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Specification
Item Silicon Substrate
Diameter 150.0±0.3mm
Thickness 625±25μm、1000±25μm、5000±25μm 200±25μm、625±25μm
Surface Finish Single side polished Double side polished
Surface Orientation <100>
Crystal Growth Method CZ
Dopant N-type (Si-doping/As-doping/Sb-doping)
Primary Flat Length 47.5±1.0mm
Resistivity 1~100Ω·cm / <0.01Ω·cm
TTV ≤20μm
BOW ≤25μm
WARP ≤30μm
Edge Exclusion ≤2 mm


Customization specifications:

* Various sizes and shapes such as 10*10mm

* Various thicknesses: 0.1~20mm

* Various surface roughness such as slicing,lapping,polishing.

* Silicon crystal ingots are available.


Properties
Silicon Substrate
Growth Method CZ/FZ
Crystal Structure Diamond
Lattice Constant(nm) a=5.4305Å
Density(g/cm3) 2.329
Melting point 1410°C
Mohs Hardness(mohs) 7
Dielectric Constant 11.8
Band Gap(eV) 1.1
Breakdown Electrical Field ((MV/cm)) 0.3
Thermal Conductivity(n-type) (W/cm.K) 1.48
Electron Mobility(cm2·V-1·s-1) 1480
Thermal Expansion 2.6×10^-6 /°C
Refractive Index 3.5
SKU: --
6 inch N type <100> Silicon Wafer
Thickness
  • 350μm
  • 1000μm
  • 3000μm
Pieces
  • 1pcs
  • 15pcs
  • 100pcs
Stock: 89999991
Quantity
$11.00 ~ 99.00

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DESCRIPTION
Our 6‑inch N‑type <100> Silicon Wafer is monocrystalline silicon substrate manufactured complying with SEMI standards. N‑type doping with strictly‑controlled <100> crystal orientation tolerance. Single‑side polished (SSP) and double‑side polished (DSP) options are offered. Custom parameters including resistivity, thickness, TTV and surface flatness can be fulfilled. Widely used for thin‑film growth, semiconductor device development, process validation, MEMS fabrication and material‑science R&D. Packaged in standard wafer carrier for safe transportation.
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