Home/ Products / Glass Wafer / Fused Silica (FLH-JGS1)
Specification
Item Fused silica JGS1
Diameter 150.0±0.3mm
Thickness 500±25μm,1000±25μm
Primary Flat Length 32.5±1.0mm
Surface Finish S/D 60/40


Customization specifications:

* Various diameters:10~300mm .

* Ultra-thin wafers can be customized,thicknesses ≥0.1mm.

* Custom shapes available, including square windows or other forms for optical applications.


Properties
JGS1 Quartz
Material High-purity(synthetic)
Main Composition SiO₂ (>99.99%)
Hydroxyl ~1000 ppm
Thermal Expansion Coefficient 0.55 × 10⁻⁶/K
Heat Resistance softening point ~1700℃
Transmission Range 185–2500 nm
UV Transmission Excellent (high transmittance >185 nm)
IR Transmission Poor (affected by absorption at 2.7 μm)
Chemical Stability Excellent
Mechanical Strength High
Main Applications UV optics, lasers, semiconductors
SKU: --
6 inch JGS1 Fused silica Wafer
Surface
  • DSP
Thickness
  • 500μm
  • 1000μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Stock: 5999994
Quantity
$60.00 ~ 200.00

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DESCRIPTION
6‑inch JGS1 ultraviolet‑grade fused silica wafer, high‑purity synthetic amorphous silica substrate with excellent deep‑UV transmission covering 185 nm‑2500 nm. Ultra‑low metallic impurities, bubble‑free interior, superior thermal stability and chemical corrosion resistance. Available in single‑side polished (SSP) or double‑side polished (DSP). Customizable thickness, edge bevel, primary flat and surface roughness. Well‑suited for thin‑film deposition, UV‑optics, MEMS, microfluidics, photonics and semiconductor research.
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