Home/ Products / Glass Wafer / BOROFLOAT® 33
Specification
Item BOROFLOAT® 33 Glass Wafer
Diameter 150.0±0.5mm
Thickness 500±25μm、700±25μm
Primary Flat Length 47.5±1.0mm
Surface Finish S/D 60/40


Customization specifications:

* Various diameters:10~300mm .

* Ultra-thin wafers can be customized,thicknesses ≥0.1mm.

* Custom shapes available, including square windows or other forms for optical applications.


Properties
BOROFLOAT® 33 Glass Wafer
Material Borosilicate glass (contains boron oxide)
Main Composition SiO₂ (~81%), B₂O₃ (~13%)
Hydroxyl <10 ppm
Thermal Expansion Coefficient 3.25 × 10⁻⁶/K
Heat Resistance softening point ~820℃
Transmission Range 300–2500 nm
UV Transmission Poor (low transmittance <300 nm)
IR Transmission Good (high transmittance at 2.7 μm)
Chemical Stability Good
Mechanical Strength High
Main Applications Optical windows, lab equipment, display panels
SKU: --
6 inch BOROFLOAT® 33 Glass Wafer
Surface
  • DSP
Thickness
  • 500μm
  • 700μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Stock: 5999994
Quantity
$25.00 ~ 60.00

ADD TO CART

paypal visa wst amex
DESCRIPTION
6 inch BOROFLOAT® 33 Glass Wafer is a high-end SCHOTT borosilicate float glass substrate with precise 150mm diameter specification. Featuring low CTE (3.25×10⁻⁶/K), ultra-low autofluorescence, high optical transmittance and excellent thermal shock & chemical resistance. It perfectly matches silicon’s thermal expansion coefficient, ensuring stable and high-yield anodic bonding. Available in SSP/DSP polished, customizable thickness, edge bevel, flat orientation and surface roughness. Widely used for large-size MEMS devices, microfluidic chips, wafer-level packaging, optical sensing and thin film deposition research.
For best experience, create an login when requesting samples.
Have a question?
Still have questions? Ask our experts!
Email +86-000-0000
Recommend Items
Copyright © Shanghai Kaihui Industrial Equipment Co. LTD All Rights Reserved
paypal visa wst amex

Powered by Bomin