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Specification
Item BOROFLOAT® 33 Glass Wafer
Diameter 100.0±0.3mm
Thickness 500±25μm
Primary Flat Length 32.5±1.0mm
Surface Finish S/D 60/40


Customization specifications:

* Various diameters:10~300mm .

* Ultra-thin wafers can be customized,thicknesses ≥0.1mm.

* Custom shapes available, including square windows or other forms for optical applications.


Properties
BOROFLOAT® 33 Glass Wafer
Material Borosilicate glass (contains boron oxide)
Main Composition SiO₂ (~81%), B₂O₃ (~13%)
Hydroxyl <10 ppm
Thermal Expansion Coefficient 3.25 × 10⁻⁶/K
Heat Resistance softening point ~820℃
Transmission Range 300–2500 nm
UV Transmission Poor (low transmittance <300 nm)
IR Transmission Good (high transmittance at 2.7 μm)
Chemical Stability Good
Mechanical Strength High
Main Applications Optical windows, lab equipment, display panels
SKU: --
4 inch BOROFLOAT® 33 Glass Wafer
Surface
  • DSP
Thickness
  • 500μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Stock: 2999997
Quantity
$15.00 ~ 50.00

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DESCRIPTION
4‑inch BOROFLOAT® 33 glass wafer, premium SCHOTT borosilicate float‑glass substrate. It features low thermal‑expansion coefficient (~3.3 ppm/°C), excellent thermal‑shock resistance, high optical transmittance and ultra‑low autofluorescence. High flatness and superior chemical stability. Available in single‑side polished (SSP) or double‑side polished (DSP). Customizable thickness, edge bevel and primary flat. Ideal substrate for silicon‑glass anodic bonding, MEMS, microfluidic chips, optical sensors and semiconductor‑related research.
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