Home/ Products / Glass Wafer / Fused Silica (PQ-JGS2)
Specification
Item Fused silica JGS2
Diameter 100.0±0.3mm
Thickness 200±25μm、500±25μm
Primary Flat Length 32.5±1.0mm
Surface Finish S/D 60/40


Customization specifications:

* Various diameters:10~300mm .

* Ultra-thin wafers can be customized,thicknesses ≥0.1mm.

* Custom shapes available, including square windows or other forms for optical applications.


Properties
JGS2 Quartz
Material Medium-purity(natural or synthetic)
Main Composition SiO₂ (>99.9%)
Hydroxyl ~200 ppm
Thermal Expansion Coefficient 0.55 × 10⁻⁶/K
Heat Resistance softening point ~1700℃
Transmission Range 220–2500 nm
UV Transmission Poor (low transmittance <220 nm)
IR Transmission Good (high transmittance at 2.7 μm)
Chemical Stability Excellent
Mechanical Strength High
Main Applications IR optics, general optics, laser windows
SKU: --
4 inch JGS2 Fused silica Wafer
Surface
  • DSP
Thickness
  • 200μm
  • 500μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Stock: 5999994
Quantity
$12.00 ~ 60.00

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DESCRIPTION
4‑inch (100 mm) optical‑grade JGS2 fused silica wafer manufactured from high‑purity silica via oxy‑hydrogen melting process. Wide transmission range from 0.22 μm‑2.5 μm, ultra‑low thermal expansion coefficient, excellent thermal‑shock resistance and outstanding chemical inertness. Available in single‑side polished (SSP) or double‑side polished (DSP). Widely used for MEMS, microfluidic chips, semiconductor carrier wafers, UV‑Vis optics, thin‑film deposition and photonic device development. Custom thickness, flat/notch, edge chamfer and surface specs are supported.
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