Home/ Products / Glass Wafer / Fused Silica (PQ-JGS2)
Specification
Item Fused silica JGS2
Diameter 200.0±0.3mm
Thickness 300±25μm、725±25μm、1000±25μm
Primary Flat Length Notch
Surface Finish S/D 60/40


Customization specifications:

* Various diameters:10~300mm .

* Ultra-thin wafers can be customized,thicknesses ≥0.1mm.

* Custom shapes available, including square windows or other forms for optical applications.


Properties
JGS2 Quartz
Material Medium-purity(natural or synthetic)
Main Composition SiO₂ (>99.9%)
Hydroxyl ~200 ppm
Thermal Expansion Coefficient 0.55 × 10⁻⁶/K
Heat Resistance softening point ~1700℃
Transmission Range 220–2500 nm
UV Transmission Poor (low transmittance <220 nm)
IR Transmission Good (high transmittance at 2.7 μm)
Chemical Stability Excellent
Mechanical Strength High
Main Applications IR optics, general optics, laser windows
SKU: --
8 inch JGS2 Fused silica Wafer
Surface
  • DSP
Thickness
  • 300μm
  • 725μm
  • 1000μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Stock: 8999991
Quantity
$45.00 ~ 200.00

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DESCRIPTION
8‑inch (200 mm) large‑size optical‑grade JGS2 fused silica wafer manufactured by oxy‑hydrogen melting high‑purity silica raw material. Broad transmission range from 0.22 μm‑2.5 μm, ultra‑low thermal expansion coefficient, outstanding thermal‑shock resistance and excellent chemical inertness. Available in single‑side polished (SSP) or double‑side polished (DSP). Suitable for 200 mm‑line MEMS pilot production, large‑area microfluidic chips, semiconductor carrier/dummy wafers, UV‑Vis‑NIR optics, thin‑film deposition and photonic device development. Custom thickness, semi‑notch, edge chamfer and surface specifications are supported.
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