Home/ Products / Glass Wafer / Fused Silica (PQ-JGS2)
Specification
Item Fused silica JGS2
Diameter 300.0±0.3mm
Thickness 775±25μm、1000±25μm
Primary Flat Length Notch
Surface Finish S/D 60/40


Customization specifications:

* Various diameters:10~300mm .

* Ultra-thin wafers can be customized,thicknesses ≥0.1mm.

* Custom shapes available, including square windows or other forms for optical applications.


Properties
JGS2 Quartz
Material Medium-purity(natural or synthetic)
Main Composition SiO₂ (>99.9%)
Hydroxyl ~200 ppm
Thermal Expansion Coefficient 0.55 × 10⁻⁶/K
Heat Resistance softening point ~1700℃
Transmission Range 220–2500 nm
UV Transmission Poor (low transmittance <220 nm)
IR Transmission Good (high transmittance at 2.7 μm)
Chemical Stability Excellent
Mechanical Strength High
Main Applications IR optics, general optics, laser windows
SKU: --
12 inch JGS2 Fused silica Wafer
Surface
  • DSP
Thickness
  • 775μm
  • 1000μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Stock: 5999994
Quantity
$100.00 ~ 200.00

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DESCRIPTION
12‑inch (300 mm) large‑size optical‑grade JGS2 fused silica wafer manufactured from high‑purity silica by oxy‑hydrogen melting process. Broad transmission range of 0.22 μm‑2.5 μm, ultra‑low thermal expansion coefficient, excellent thermal‑shock resistance and superior chemical inertness. Available in single‑side polished (SSP) or double‑side polished (DSP). Designed for 300 mm‑compatible semiconductor lines, advanced packaging, large‑area MEMS, photomask blanks, UV‑Vis‑NIR optics and thin‑film deposition. Custom thickness, semi‑notch, edge chamfer and flatness specifications are supported.
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